Press Releases -> Invention Syndicate content

Nov 08, 2017

State-of-the-art Fan-out Wafer Level Packaging (FOWLP) development line will enable IME’s consortium members spanning across the industry value chain to develop cost-effective advanced packaging solutions, and spur high-volume manufacturing of next-generation Internet of Things (IoT) technologies

Oct 14, 2017

We are at the cusp of a major revolution from mobile to immersive computing. Last year was seen as the dawn of a third wave of devices employing augmented and virtual reality (AR and VR), which define the two spectrums of immersive technology that could replace mobile computing.